Ultra-thin cutting blade cutting is a processing method of ultra-precision grinding. It is technically slow-feed grinding or high-efficiency deep grinding, and has a wide range of application requirements. Ultra-thin dicing wafers are often used for precision cutting of electronic and optical devices, such as semiconductor silicon wafer dicing. The machined workpiece has the advantages of low surface roughness, high shape accuracy and high surface integrity. The thickness of ultra-thin cutting sheets ranges from 0.015 to 2.000 mm, often below 0.300 mm, and the outer edge diameter ranges from 50.0 to 152.4 mm. It can be called an ultra-thin and ultra-hard material cutting wheel, or a wheel blade; or an ultra-thin wheel. Considering its function, we generally call it "ultra-thin cutting wheel".

The processing of electronic and optical devices requires high precision. When processing with ultra-thin cutting wheel, the deformation itself will inevitably affect the processing accuracy of the device. At the same time, the amount of grinding (speed of cutting blade, grinding depth, and feed rate) will also affect the surface quality of the device after processing, and it is necessary to reasonably combine the processing parameters. When the ultra-thin cutting blade rotates at high speed, it is prone to radial deformation due to the centrifugal force and the grinding force. The centrifugal force causes the radial expansion, and the grinding force causes the radial compression. Both centrifugal force and grinding force are related to the amount of grinding. Ultra-thin cutting discs have different radial deformations under different grinding amounts, and this radial deformation will change the actual grinding depth and affect the machining accuracy of the workpiece. Clarifying the influence of grinding amount on the deformation of the cutting blade helps to optimize and select the processing parameters, and compensating the deformation of the cutting blade during processing helps to improve the processing accuracy.

Generally, there are six types of ultra-thin cutting wheels as below types.

Kemei produces all types below ultra-thin diamond cutting blades. 1A8 cutting wheel, 1A1 type cutting discs,1A1R shape slicing disc, 1E8 slicing wheel, 1B8 cut off wheel, 1B1 diamond saw blade.

Contact for more.